Sr. Staff Backend Integration Engineer

Thin Film Electronics ASA (Ticker: THIN.OL) delivers electronics for ultra-high-volume, cost-sensitive applications. We use roll-to-roll printing to manufacture electronics, introducing intelligence where it has never before been possible—at a cost-per-function unmatched by any other electronic technology.

In this position you will be responsible for the integration and manufacturing qualification of custom technology elements that constitute our ground-breaking printed electronics technology.  You will be a key technology interface to the manufacturing, design and product engineering/management organizations, generating and delivering all aspects of process/device technology performance requirements.  This person will own technology development from materials innovation to reliability qualification and handoff to manufacturing.


  • Lead backend cross functional team (interacts with manufacturing, front end process, backend assembly, technology development, and design teams). Resolve materials and device cross module interactions.
  • Develop roll-to-roll scalable materials stacks and front-end process flows which ensure compatibility with back-end processes
  • Own technology qualification processes from concept to manufacturing.
  • Execute and contribute to technology roadmap elements for cost reduction and value addition.
  • Contributes to patent and innovation portfolio.



  • 7+ years related process and device integration ownership in a leading-edge technology development organization.
  • Deep materials understanding and experience with semiconductor backend processing including advanced bump technologies, UBM, plating, printing, dicing, and flip chip assembly is a must.
  • Basic understanding of transistor design.
  • Demonstrated record of innovation leading to manufacturable solutions and product qualification
  • Excellent knowledge in semiconductor processing, device, and materials interactions
  • Experience with RFID and roll to roll processing is a plus.
  • Experience with JMP (or similar SW), FMEAs, DOEs, and mask designs.
  • Proven record in resolving complex cross module interactions, root cause analysis, FA (electrical and physical).
  • Demonstrated ability to learn and adapt to new fields quickly in a hands-on fast-paced environment
  • Strong track record in execution and project management.
  • Excellent written and verbal communication skills.
  • MS (Ph.D preferred) degree in Materials/Chemical Engineering, or Electrical Engineering .


To apply, please click here.